The combined expertise across 90 plants in 22 countries offers more localized design and engineering support throughout North ...

CPO integrates optical components directly into a package, replacing long copper traces with shorter connections.

Staying inside increasingly narrow process windows as specialty devices scale, diversify, and enter high-volume production.

Metal Injection Molding is changing medical device manufacturing by enabling the production of intricate, high-quality ...

At DesignCon 2026, Samtec showed active demonstrations across two generations of high-speed interconnect, with working ...

As AI clusters grow larger, they begin to use optical interconnects for scale-out connectivity. However, the day when they require optical interconnects for scale-up connectivity may be approaching ...

Seeking to expand IBM’s logic scaling roadmap, the company is partnering with Lam Research on new processes and materials to support sub-1 nm logic scaling. The agreement will focus on the joint ...

Abstract: The research on lifetime models of power module has already started in the late 1990s. However for the transfer molded discrete package, there is still a shortage of investigation on their ...

# SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause RPMh hardware accelerators known as Bus Clock Manager (BCM). See also: include/dt-bindings/interconnect/qcom ...

Francesco Manegatti, co-founder and CEO of NcodiN, and Eléonore Hardy, Silicon Photonics Partnership Manager, CEA-Leti, discuss the partnership between CEA-Leti and NcodiN, a French deep-tech startup ...