Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
Vishay Precision Group, Inc. announced that its Vishay Foil Resistors brand (VFR) has released a new series of high-precision foil surface-mount current sensing flip chip resistors with low TCR down ...
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
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