ZDNet

Microsoft starts testing 'Update Stack Packages' to help streamline Windows updating process

Microsoft has been expanding the number of different ways it can update Windows components for a while now. Today, October 14, officials announced they're beginning to test yet another vehicle for ...
Mena FN

Advanced Semiconductor Packaging Market Research Report 2025-2035: 3D Stack Memory Technologies Power Next-Gen Electronics With High-Performance, Miniaturized Solutions

(MENAFN- GlobeNewsWire - Nasdaq) Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and ...
Morningstar

Socionext Expands 3DIC Support with Advanced 3D Die Stacking and 5.5D in Packaging Portfolio

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
Electronic Design

Packaging: DRAM Stacking Technology Enables High-Density Modules

Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...