Dynamic optimisation and model predictive control (MPC) are at the forefront of modern process systems engineering, offering robust methodologies to address the challenges posed by time-varying ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Process automation and control encompasses hardware, software, systems and methods that measure, regulate, manipulate and visualize industrial processes for optimum consistency, efficiency and safety.
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