Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.
TOKYO--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “MG800FXF2YMS3,” a silicon carbide (SiC) MOSFET module integrating newly developed dual channel SiC ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
Enhancing thermal management in electric vehicle propulsion systems: A focus on optimizing irregular pinfin structures and collaborative design with dc bus capacitors and motors The paper investigates ...
Why cross-disciplinary innovation works best in miniaturization efforts. How changes in board connections are creating new design challenges. Rethinking connector layouts to overcome those challenges.
COLORADO SPRINGS, CO (September 9, 2025) Frontgrade Technologies, a leading provider of high-reliability electronic solutions for space and national security missions, today announced the release of ...
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