Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower ...
The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...
As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But ...
Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...
The AI boom is driving up the power demands of CPUs, GPUs, and other high-performance SoCs in data centers—and they show no signs of slowing down. Today, the most advanced AI chips are bordered on ...
In brief: At its recent Foundry Forum event, Samsung revealed a fresh roadmap, showing off bleeding-edge process technologies and advanced chip packaging solutions. With breakthroughs in 2nm and 1.4nm ...
Challenges like higher selectivity and precise etching are critical for angstrom-scale IC production. Advanced RF pulsing and plasma control enhance precision in sub-nanometer processes. New impedance ...
The Universal Serial Bus (USB) started out as a data interface, but it didn’t take long before progressing to powering devices. Initially, its maximum output was only 2.5 W; now, it can deliver up to ...
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