Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also brings greater complexity and ratchets up the number of design decisions ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

The entire power-electronic sector, including RF applications and systems involving high-speed signals, is evolving toward solutions that offer increasingly complex functionalities in ever-smaller ...

A thermally-conductive PCB substrate, Tlam SS LLD enables effective heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate allegedly provides eight ...

FR4 is FR4, right? For a lot of PCB designs, the answer is yes — the particular characteristics of the substrate material don’t impact your design in any major way. But things get a little weird up in ...

Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF substrates to meet ...