Hosted on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Kioxia Corp., a Japanese semiconductor manufacturer formerly known as Toshiba Memory, was sued by MonolithIC 3D on Nov. 26 in Texas Eastern District Court over alleged infringement of eight patents ...
A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains. Subscribe to our newsletter for the ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results