Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

Indian-origin professors Subhasish Mitra of Stanford University and Tathagata Srimani of Carnegie Mellon University are at the centre of a breakthrough that could reshape how artificial intelligence ...

With the recent ratification of the Universal Chiplet Interconnect Express (UCIe) 3.0 standard in August 2025, the industry has finally established a "lingua franca" that allows chips from different ...

A new technical paper titled “Enabling static random-access memory cell scaling with monolithic 3D integration of 2D field-effect transistors” was published by researchers at The Pennsylvania State ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...

Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration ...