Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Designing electronic systems that comprise multiple interacting boards, connectors and cables requires a multi-discipline team collaboration to effectively manage design complexity for optimum product ...

Designing a complex chip today and getting it out the door on schedule and within budget — while including all of the necessary and anticipated features and standards — is forcing engineering teams to ...