3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...

Flow delivers a 5-10X boost in productivity for mobile and consumer applications MOUNTAIN VIEW, CA AND CAMBRIDGE, UK—Mar. 28, 2007—Synopsys, Inc. (Nasdaq: SNPS), a world leader in semiconductor ...

Magma(r) Design Automation Inc. (Nasdaq:LAVA – News), a provider of chip design software, today announced that the Talus(r) IC implementation system has been included in TSMC Reference Flow 10.0. With ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

SAN JOSE, Calif., 17 Oct 2019-- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the complete, integrated Cadence ® 3D-IC advanced packaging integration flow has achieved certification ...

Since its formation in December 2010, the SEMI 3DS-IC Standards Committee has made significant progress in establishing key standards in areas such as TSV metrology, glass carrier wafers, and ...

As chip manufacturing scales up, water supply and wastewater treatment systems are under immense pressure. Cutting-edge ...