When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Efficiently identify and map tire fillers with streamlined material analysis—explore the details in this application note.

Each phase of a project has unique failure signature patterns. Just like the bathtub curve in Figure 2, we see more “failures” in the initial design, development and early production “ramp up” phase.

Root cause failure analysis (RCFA) addresses a problem that has appeared in a previously stable environment. Although this technique is most often applied to a production environment, the principles ...