During the chemical mechanical polishing of wafers, the CMP pad is used to store the CMP polishing solution and transport it to the polishing area, so that the polishing continues evenly and the ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

According to the annual report of Applied Materials and data from Cabot Microelectronics, the number of CMP process steps required for 14nm logic chips has increased from 10 times for 180nm chips to ...