Dublin, May 20, 2025 (GLOBE NEWSWIRE) -- The "Automotive Parts Packaging Market Size, Share & Trends Analysis by Packaging Type (Reusable, Disposable), Component Type (Battery, Underbody Components), ...

DUBLIN--(BUSINESS WIRE)--The "North America Automotive Parts Packaging Market to 2027 - Regional Analysis and Forecasts by Product Type; Packaging Type; and Component" report has been added to ...

DS Smith, an International Paper company, and leading provider of fiber-based corrugated packaging solutions, announces its collaboration with TPV Automotive, a global supplier of manufactured ...

The ongoing trend of automotive electrification, intelligentization and connectivity are driving a significant increase in the quantity and cost of chips used in vehicles. The cost of a single chip in ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...

Power electronics packaging is experiencing new trends as a result of the needs of high power applications, with automotive market being a strong driver. The continuous electrification of functions in ...

Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors to fund its ...

Fastener packing systems, with automation-ready design and accuracy-focused engineering, are more effective for small components than general-purpose systems. As a China Top Fastener Packing System ...

The Suppliers Partnership for the Environment (SP), a Washington-based association of global automakers and their suppliers with the goal of advancing environmental sustainability through the ...

In the absence of comprehensive federal regulation of PFAS in food packaging, states are dishing out their own laws. Thus far, eleven states have enacted laws concerning PFAS substances in food ...

Trends in next-generation battery packaging architectures. Optimizing packaging space with cell-connecting systems. Novel solutions for solving EMI, thermal management, and range-anxiety challenges.