The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Researchers have pioneered a technique to observe the 3D internal structure of rechargeable batteries. This opens up a wide range of areas for the new technique from energy storage and chemical ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Lancaster University researchers have pioneered a technique to observe the 3D internal structure of rechargeable batteries for the first time. The research, published in Nature Communications, is led ...